Weld-solder filler

ABSTRACT

Conventional weld fillers contain copper, aluminum and manganese. These weld fillers are as a rule not suited for the welding of thin or rust-free sheet metals. The inventive weld filler contains 0.5 to 6.0 percent by weight Al, 0.5 to 8.0 percent by weight Mn, the usual impurities are less than or equal to 1.0 percent by weight and as the remainder Cu. This weld filler is better suited for the welding of thin or rust-free sheet metals than the up to now known weld fillers.

[0001] This application is a continuation-in-part application of Ser.No. 09/608,850, filed Jun. 30, 2000.

FIELD OF THE INVENTION

[0002] The invention relates to a filler with copper, aluminum andmanganese for soldering and/or welding.

BACKGROUND OF THE INVENTION

[0003] Such fillers are known from the state of the art and are alsostandardized in the DIN 1733, Part 1. Fillers must be chosen in such amanner that strength values of the solder-weld connection reach at leastthe guaranteed performance values or standard values of the basematerial. Sufficient deforming ability of the welding material isparticularly of importance when the base material has a low suitabilityfor welding. Particular problems exist thereby in the MIG soldering oftinned or aluminized thin sheet metals or, however, the MIG soldering orrust-free steel plates. Also problematic is often the build-up weldmaterial.

[0004] When welding thin sheet metal a distortion of the sheet metaloccurred up to now because the heat penetration through the sheet metalwas too high. A further problem is often the lack of flow and wettingbehavior of the material and weld filler. A uniform bath is then notcreated between the two pieces to be welded, which bath guarantees apermanent connection.

SUMMARY OF THE INVENTION

[0005] The purpose of the invention is therefore to provide a filler,which is suited for welding, however, in particular also with an impulsearc through the MIG soldering to connect coated sheet metal plates andrust-free steels, for example 1.4301 and similar ones, and guaranteesbesides a low energy input and thus a low structural part distortion, agood flow and wetting behavior, a good gap bridging and a strong seam.Furthermore, the weld-solder filler has a good corrosion resistance andpermits fast joining speeds.

DETAILED DESCRIPTION

[0006] This purpose is attained according to the invention in such amanner that the filler contains in percentage by weight 0.5 to 7.0% Al,0.5 to 8.0% Mn, the usual impurities less than or equal to 1.0% and theremainder Cu.

[0007] In contrast to the fillers known from the state of the art, theabove set forth filler has an adapted melting point, which results in alow heat input and thus also in a low amount of distortion of the weldedpieces. Thus the filler is suited in particular for thin sheet metalplates and also for rust-free steels, like 1.4301 DIN 17440 of less than4.0 mm and even less than 1.5 mm thickness. The good flow and wettingbehavior results in a uniform flat seam, which is essentially free ofpores. The filler itself is well drawable and can therefore be preparedas a small diameter wire of, for example, 0.8 mm.

[0008] The filler in addition contains advantageously in percentage byweight 0.01 to 4.0% iron and/or 0.01 to 6.0% nickel. Usual impuritiesare each to be no higher than 0.01 to 0.3% silicon, 0.01 to 1.0% zinc,0.01 to 0.5% tin, 0.01 to 0.1% chromium and 0.01 to 0.1% cobalt.

[0009] A further advantageous filler contains 5 percent by weightaluminum and 2 percent by weight manganese.

[0010] Whereas a further advantageous filler contains according to theinvention 2 percent by weight aluminum and 6 percent by weightmanganese.

[0011] A third advantageous filler has 6 percent by weight aluminum, 1percent by weight manganese, and 1 percent by weight nickel.

[0012] A fourth advantageous filler has 5% Al, 1% Mn and 1% Ni.

What is claimed is:
 1. In a weld-solder filler composition utilized insoldering and welding processes, the improvement comprising saidweld-solder filler composition containing, in percent by weight: 0.5 to7.0% Al; 0.5 to 2.0% Mn; 0.01 to 4% Fe; 0.01 to 6% Ni; no more than 1.0%impurities; and the remainder being Cu.
 2. The weld-solder fillercomposition of claim 1, wherein the following impurities, if present,are contained in the indicated ranges: 0.01 to 0.3% Si; 0.01 to 1.0% Zn;0.01 to 0.5% Sn; 0.01 to 0.1% Cr; and 0.01 to 0.1% Co.
 3. Theweld-solder filler composition of claim 1, wherein 6% Al, 1% Mn and 1%Ni are present in the filler composition.
 4. The weld-solder fillercomposition of claim 1, wherein 5% Al, 1% Mn and 1% Ni are present inthe filler composition.
 5. The weld-solder filler composition of claim1, wherein 5% Al is present in the filler composition.